Outline
- Why Semiconductor Equipment Needs Modernization? Introduction to On-Site Pain Points
- Core Architecture Design: Modularity, Scalability, AI Readiness
- Framework Technical Components:
- Communication Layer (SECS/GEM, Modbus, MCProtocol)
- AI Modules (e.g., Defect Detection, Image Analysis)
- Data Processing & Transmission (Redis, SQLite/PostgreSQL, InfluxDB)
- User Interface (Django REST + Vue.js Single-Page Application)
- Sample Workflow: From Equipment Data to Decision Recommendations
- Integration Methods with MES and FDC Systems
- Challenges and Reflections During Implementation
- Q&A
Target Audience
- Python developers interested in industrial automation
- Engineers exploring AI applications in manufacturing
- System integration engineers in semiconductor or electronics manufacturing
- Technical decision-makers considering open-source technologies for equipment upgrades